Cabinet Clears Four New Semiconductor Projects Worth ₹4,600 Crore; Over 2,000 Jobs to be Created
The Union Cabinet, chaired by Prime Minister Narendra Modi, has given the green light to four new semiconductor projects under the India Semiconductor Mission (ISM), furthering the country’s push towards building a strong chip manufacturing ecosystem.
The approved projects, with a combined investment of ₹4,600 crore, are expected to generate 2,034 direct skilled jobs and numerous indirect employment opportunities. With these additions, the total number of projects sanctioned under ISM has now reached 10, with planned investments totalling nearly ₹1.60 lakh crore across six states.
The latest approvals involve proposals from 3D Glass Solutions Inc., Continental Device India Private Limited (CDIL), and Advanced System in Package (ASIP) Technologies. SiCSem and 3D Glass will set up plants in Odisha, CDIL will expand operations in Punjab, and ASIP will establish a facility in Andhra Pradesh.
SiCSem, in partnership with the UK’s Clas-SiC Wafer Fab Ltd., will build India’s first commercial compound semiconductor fabrication unit in Bhubaneswar, with an annual production capacity of 60,000 wafers and 96 million packaged units. These will serve industries including defence, electric vehicles, railways, data centres, and renewable energy.
3D Glass Solutions will also establish a Bhubaneswar unit to introduce advanced packaging technology, manufacturing glass interposers, silicon bridges, and 3D heterogeneous integration modules for high-performance computing, artificial intelligence, photonics, and defence.
ASIP Technologies, in collaboration with South Korea’s APACT Co. Ltd., will set up a semiconductor packaging facility in Andhra Pradesh with an annual capacity of 96 million units for mobile devices, automotive applications, and consumer electronics.
Meanwhile, CDIL will expand its Mohali plant to produce high-power devices such as MOSFETs, IGBTs, and Schottky diodes, with a targeted annual capacity exceeding 158 million units.
Officials said the projects will provide a major boost to the semiconductor ecosystem, introducing the nation’s first commercial compound fab and an advanced glass-based substrate packaging unit. They will complement the country’s rapidly growing chip design capabilities, supported by government-backed design infrastructure extended to 278 academic institutions and 72 start-ups.
